Contact Info

Biography

Website: http://users.rowan.edu/~xuew/

Education:

Ph.D., Mechanical Engineering, University of Minnesota, 2007
M.S., Electrical Engineering, Shandong University, Jinan, China, 2000
B.S., Electrical Engineering, Shandong University, Jinan, China, 1997                          

Research Expertise: 

Functional materials; nanomaterials; composites; nanotechnology; sensors and actuators; wearable electronics

My research interests are in the areas of functional materials, sensors, actuators, and wearable electronics. In particular, our group studies materials, devices, and systems at the micro- and nano-scale. Currently we are working on composites materials, flexible electronics, and soft robotics.         

Professional Memberships:

ASME (American Society of Mechanical Engineers)                              
IEEE (Institute of Electrical and Electronics Engineers), Senior Member

Recent Publications:

Muhammad Usman, Nabil Jamhour, Jeffrey Hettinger, and Wei Xue, “Smart wearable flexible temperature sensor with compensation against bending and stretching effects”, Sensors and Actuators A: Physical, Vol. 353, p. 114224, 2023.

Jacob Mahon, Nicholas Pagliocca, Virginia Harnack, Behrad Koohbor, Robert Krchnavek, and Wei Xue, "Design and implementation of a thin film tensile testing apparatus for cryogenic applications", Experimental Techniques, Vol. 47, No. 4, pp. 817-826, 2023.

Jacob Mahon, Nicholas Pagliocca, Virginia Harnack, Behrad Koohbor, Lei Yu, Xiao Hu, Robert Krchnavek, and Wei Xue, "Mechanics of dielectric polyamide/SiO2 nanocomposite coatings for cryogenic service in superconductor systems", Journal of Applied Polymer Science, Vol. 139, No. 44, e53097, 2022.

Muhammad Usman, Adarsh K. Gupta, and Wei Xue, "Wearable ring bioelectrical impedance analyzer for estimation and monitoring of body fat", Smart Health, Vol. 24, p. 100275, 2022.

Harrison M. Hones, Jordan T. Cook, Michael J. McCaffrey, Robert R. Krchnavek, and Wei Xue, "Effects of material preparation in polyimide/SiO2 nanocomposites for low-temperature dielectric applications," IEEE Transactions on Nanotechnology, Vol. 20, pp. 695-702, 2021.